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> Smd bga ic desktop lcd large reflow oven 11.8X12.6 inch
Smd bga ic desktop lcd large reflow oven 11.8X12.6 inch
2. Eight pre-set heat reflow temperature waveforms/curves for selection. Manual heating and forced cooling functions are also available.
3. Easy operation. The whole SMD/BGA soldering process is done automatically.
4. Infrared and hot air circulation heating. Temperature is more accurate and even.
5. Fuzzy temperature control and transparent drawer.
6. Can solder small SMT components. Can also be used for CHIP, SOP, PLCC, QFP single and double sided PCB soldering.
8. Max temperature that can be set is 280C.
â—† Voltage: 220V /110V AC +-10% (specify at checkout) â—† Output power: 1500W â—† Dimension: 430 x 370 x 260 mm â—† Weight: 14kg approx. â—† Work cycle: 1 to 8 min. â—† Effective soldering area: 300 x 320 mm (11.8 x 12.6 inch)
1. International: 85Sn/15Pb 70Sn/30Pb
2. International: 63Sn/37Pb 60Sn/40Pb
3. American: Sn/Ag3.5 Sn/Cu.75 Sn/Ag4.0/Cu.5
4. American: Sn/Ag2.5/Cu.8/Sb.5 Sn/Bi3.0/Ag3.0
7 & 8: User-defined temperature curves.
Just add USD29 for an additional spare heating element when purchasing with the machine!
