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Upgraded ag heatpulse 8108 ( by ALLWIN21 corp software)


AG Heatpulse 8108 Series are single-wafer, cassette-to-cassette rapid thermal processors, capable of processing in inert or corrosive ambient. The unit is built for the production environment. AG8108 is a rapid thermal processor which uses high-intensity, visible radiation to heat single wafer for short periods at precisely controlled temperatures. These capabilities, combined with the heating chamber's cold-wall design, superior heating uniformity, AW Control Software and Superior Temperature Control Technology provide significant advantages over conventional furnace processing and conventional RTP systems.
Upgraded AG Associates Heatpulse 8108’s key features include:
l Robot control ability. (Equip Tech. robot with one arm)
l Gold coated aluminum chamber with water cooling
l Radiation heating lamp module
l Precise Temperature/Time control, Temperature measuring precision ± 1°C.
l Multiple cycle processing capability
l Steady Temp Range: 600°C to 1250°C for pyrometer sensor, 100°C to 600°C for Thermocouple.
l Steady state process time 0 to 30000 sec programmable.
l Temp Ramp-up Speed: 10°C to 120°C for wafer. Programmable
l Ramp down speed 10°C - 150°C for wafer
l Robot wafer cycling: 80 Wafers/Hr.
l New hardware includes: three interface cards with cable, new timer counter with watch dog, Pentium Computer with 17” LCD Monitor, standard keyboard and mouse.
l Software calibration and easy to be done.
l More functions and I/O hardware “exposed” for easier maintenance and trouble shooting.
l It is easy to edit recipe with GUI and graph display.
l Save all process data on the computer hard disk.
l A/D and D/A precision is 14 to 16 bits.
l Detect in process and with color curve displayed on the screen.
l Robot teach is on the GUI and easy to do the procedure with new concept teaching method.
l Lamp damage detect in process.
l Software watch dog to eliminate machine damage duo to the computer locks up or freeze.
l Sensor status detect function.
l High-intensity visible radiation heats wafers for short periods. Fast heating and cooling rates unobtainable in conventional technologies.
l Consistent wafer-to-wafer process cycle repeatability.
l Elimination of external contamination.
l Small footprint and energy efficiency.
AG 8108 RTA RTP is a versatile tool, which is useful for many applications:
For a bibliography and reprints of technical journal articles regarding these upgraded applications, contact the Allwin21 Corp. Marketing Communications Department.
Upgraded AG Associates 8108 RTA RTP performance specification:
l Recommended Steady-State Temperature Range: 100-1250° C.
l Steady-State Temperature Stability: ± 1° C.
l Temperature Monitoring Mechanisms: Extended Range Pyrometer (ERP),used for process temperatures from 600°C to 1250°C or a thermocouple, used for process temperatures below 800° C.
Sheet resistivity(Post-anneal sheet resistivity measured on a 150mm wafer annealed at 1100° C for 10 seconds. R&D models optimized for slip control):
Implant: As 1E16 50 KeV with implant uniformity 0.3%
Advanced Upgraded AG Heatpulse8108 specifications above may change as different models are introduced or as design enhancements are implemented.



Upgraded ag heatpulse 8108 ( by ALLWIN21 corp software)